Electronics Forum | Wed Nov 04 08:49:44 EST 2009 | kpm135
Its been a while since I've worked with a QSP-2 but I seem to remember that they should have a puff off value where the machine will actually blow the part off of the nozzle. I think it was adjustable under the component handling but I can't remember
Electronics Forum | Fri Dec 18 06:08:14 EST 2009 | fönsi
I measured the diference soldering the TC to the pad and just tape down it, because i had a trouble with accuracy of some TC's. For the TC's I just taped down, I used additional heat-conductive paste to make a a termal connection from the TC to the s
Electronics Forum | Thu Dec 17 18:08:41 EST 2009 | lynn_norman
Back in a former life, we had 3 products that were PCBs bonded to aluminum boards. We used a PSA from 3M to bond the board to the aluminum. Polymers are almost invisible in x-ray, but ultrasound worked quite well. You should try CSAM. Don't know
Electronics Forum | Wed Feb 10 08:55:14 EST 2010 | blnorman
X-ray is probably more useful in the grand scheme of things. SAM will, like Glenn said, pick up delams in components especially at internal interfaces. X-ray will only pick up a defect like this if it's perpendicular to the delam, very difficult.
Electronics Forum | Tue Feb 02 08:50:20 EST 2010 | stepheniii
Is it possible the 70% are marginal and the board shop is being uber picky? I've seen a huge range of quality standards for board shops. And considering the cost of the boards I think a boardshop tour would be warrented to get firsthand knowledge o
Electronics Forum | Mon Feb 08 20:18:39 EST 2010 | city4497s
Hi I'm looking for a auto mold machine for PCBA application in singapore, anyone have any recommendation. My PCB size is 160mmX42mmX0.6mm, the units are arrange in array form and there are about 12 ~ 20 unit per strip. the mold size is about 15mmX5m
Electronics Forum | Mon Mar 08 16:23:05 EST 2010 | mikesewell
I'd think about database structure and programming aspects as well. I'm cleaning up an implementation where the parts were taught as they appeared to the AOI programmer irrespective of the Pick & Place data/libraries. Lots of rotation fixes, parts
Electronics Forum | Mon Mar 15 15:14:08 EDT 2010 | cisridn
Does anyone have experience with reworking PCB's with coins bonded to the them? I have been having trouble with coins loosing the bond after rework and falling off. The material bonding the coin to the board is suppose to be able to withstand tempe
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Thu Apr 08 13:28:24 EDT 2010 | mabdalla
Thanks DucHoang, One more favor. Will really appreciate if you can point us on how to figure out the number of patterns (number of offsets) from the VIOS file. Also we would like to know the feeder types represented by the numbers in the &F sectio