Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef
IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"
Electronics Forum | Wed Sep 25 07:53:10 EDT 2002 | zanolli
Send me a drawing or sketch and I may be able to reccomend a supplier. fax: 401-781-5730 phone: 401-785-4110
Electronics Forum | Tue Oct 08 19:02:03 EDT 2002 | mjabure
Have you checked out autosplice? their URL is http://www.autosplice.com. They may be able to help you out.
Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare
0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare
Electronics Forum | Wed May 03 13:06:54 EDT 2000 | Sal
GUYS SEEING A PROBLEM WITH SOLDER PASTE LEACHING. THE PCB IS HASL FINISH , AND THE DEVICE IN QUESTION IS A O.O30" PITCH RESNET. THE SIZE OF THE PADS ARE 0.020 x 0.0.047 THOU , THE APERTURE SIZES ARE 0.018 x 0.042 THOU . THE LEACHING IS OCCURING DUE
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Mon Sep 14 08:10:34 EDT 2015 | iamera
Hello Our production face a problem where our board after etching become shrinkage till 0.09mm but sometime it can be till 0.18mm. this happen after etching still the beginning of process not count for silver through hole and carbon process where th
Electronics Forum | Tue Jun 20 20:31:12 EDT 2000 | Dave F
Chrys you're fine. On scoring: * Be sure spec material remaining, not what is removed. * Be sure that the v-grooves are perpendicular to each other, not off set. * Typ spec for for .062 thick boards FR-4 0.018-0.024 MC-3 0.030-0.040 * HADCO recomm
Electronics Forum | Thu Jan 31 09:08:27 EST 2008 | glezfl36
Since the implementation of the ROHS process in our Company with the higher temp requirements, we had observed an increase in problems related to delamination in the PCB's. Actually we are using FR408 and Gracescore materials and are changing to a Ve
.gif)
winsouce.jpg)