Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
Electronics Forum | Wed Mar 02 10:24:48 EST 2005 | Guest
Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.
Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest
I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Tue Mar 05 22:35:49 EST 2002 | Nell
Hi Pete and Dave, I already check with Practical component, Tessera and TopLine Dummy component they said they only have up to 0.5mm pitch CSP. Anyway, thanks for your input... Do both of you know in the market right now is there any 0.4mm pitch C
Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000
What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto
I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal
Electronics Forum | Tue May 25 12:59:37 EDT 2004 | gregp
Mils to MM is actaully English to metric. 1 mil is equal to 1 thousandth of an inch (0.001")or 0.0254mm so... 12mil pitch qfp is 0.012" or 0.3mm 15mil pitch qfp is 0.015" or 0.4mm 20mil pitch qfp is 0.020" or 0.5mm (Numbers are rounded)
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
