Electronics Forum | Fri Sep 11 16:52:00 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen
Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:
Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y
Electronics Forum | Mon Sep 24 12:58:31 EDT 2018 | vincentl
We are attaching 0.50mm diameter SAC 305 solder balls onto 0.38 diameter Au plated pins placed at a 0.80mm pitch (pins are pressed into a plastic insulator). A tacky flux is then stenciled onto the pins using a stencil with.a 0.38mm diameter aperture
Electronics Forum | Fri Jun 02 16:30:42 EDT 2000 | Michael Parker
I found a reference to Cost of Conversion earlier this year. Basically, the average cost to convert a single component from raw materials to assembled goods is $.08, just after pick and place. After placement and before reflow, repair (solder paste r
Electronics Forum | Fri May 04 11:42:48 EDT 2012 | scottjwarren
Greetings! I run a small CM company in the Midwest. We built our business on THT production for the boutique music products industry and are currently planning our launch of a low-volume/high-mix SMT line to support the growth of our business. Our
Electronics Forum | Sun Jul 28 16:11:40 EDT 2013 | jfs
Greetings! I run a small CM company in the > Midwest. We built our business on THT production > for the boutique music products industry and are > currently planning our launch of a > low-volume/high-mix SMT line to support the > growth of our
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
