Electronics Forum | Wed May 03 13:06:54 EDT 2000 | Sal
GUYS SEEING A PROBLEM WITH SOLDER PASTE LEACHING. THE PCB IS HASL FINISH , AND THE DEVICE IN QUESTION IS A O.O30" PITCH RESNET. THE SIZE OF THE PADS ARE 0.020 x 0.0.047 THOU , THE APERTURE SIZES ARE 0.018 x 0.042 THOU . THE LEACHING IS OCCURING DUE
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Wed Apr 10 22:23:48 EDT 2002 | davef
IPC-6012A, 3.4.1 has words to the effect of: Hole size tolerance and hole pattern accuracy shall be as specified in the procurement documentation. Our fab says: Standard Drill Sizes Drill Number ||Hole Size ||Finished Hole Size 70 ||0.028" ||0.02
Electronics Forum | Wed Apr 10 22:24:30 EDT 2002 | davef
IPC-6012A, 3.4.1 has words to the effect of: Hole size tolerance and hole pattern accuracy shall be as specified in the procurement documentation. Our fab says: Standard Drill Sizes Drill Number ||Hole Size ||Finished Hole Size 70 ||0.028" ||0.02
Electronics Forum | Wed May 10 00:27:46 EDT 2006 | Chris
Russ, By a longer profile you mean a more even slope across the entire profile. Unfortunately I only have a 5 zone oven that is fairly short. How many heated zones are you using? Did you shrink the 0402 pad design and leave less pad exposed out a
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