Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Fri Sep 10 15:15:09 EDT 2021 | majdi4
Hello to all , Could you help with this defect .. Tombstoning 0201 , always at the same place in board , only this component near to the coax connector..with a defect rate of 2 % ..All the process is perfect . i cheked : stencil design , SPI resul
Electronics Forum | Tue May 03 21:48:31 EDT 2005 | KEN
....and defect free! Call now for the low low introductory price... Get some "cold heat" soldering irons thrown in too.
Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
Electronics Forum | Mon Sep 27 10:53:24 EDT 2021 | majdi4
Thank you all for your quick reply ! the problem is solved without making any intervention on line .. 0% defect rate for the moment .. for all of you who said "try rotating the board 180 °", we can't do that because the panel contains 2 boards head t
Electronics Forum | Wed Dec 04 21:39:53 EST 2002 | davef
As you say, some BIG time force has pulled the metalization from the bottom of the component termination. From the pix it's hard to say whether it was caused by either: * Mechanical flexure of the board during an unusual heating or other processing
Electronics Forum | Sat Jan 29 23:55:58 EST 2005 | KEN
I recently ran a process evaluation (Print/ P&P /Reflow) and was plesently surprised with a 5.0 sigma process or 250ppm. Attrition was under 1%. Keep in mind this is defects counted Post-reflow. The most signifficant defect was tombstoning / draw-
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
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