Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Tue Nov 12 17:11:32 EST 2013 | mondalaci
Hi Folks, I'm working on a LED display that is composed of multiple layers. What is interesting for the point of this discussion is the PCB layer and the light deflector layer on top of it. Please take a look at the related pictures at http://plus
Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee
Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board
Electronics Forum | Mon Jul 20 02:35:42 EDT 1998 | Asher Levy
Looking for recommendation, need your on hand experience to decide on narrowing stencil opening relatively to actual pad on pcb for 0603 and 0402 components also info on stencil thickness ? (I have a very dense board with 0603 and 0402 comp.) Thx
Electronics Forum | Tue Jul 06 04:08:11 EDT 2004 | Pad2Pad.com
Hi All, A new version of Pad2Pad 1.3.0 is available for download. It contains multiple new price-time combinations. The list of parts and footprints is extended with DIP sockets, diodes, electrolytic SMT capacitors, popular transistors and ICs. Yo
Electronics Forum | Thu Apr 26 18:39:45 EDT 2001 | jagman
I'm looking for information (links) to pad design and layout spec's for different sized passive SMD's. To be specific, 0603, 0805, 1206 and 3216 sized parts. I'm most interested in finding out about land spacing between two parts. What is accepabl
Electronics Forum | Tue Apr 30 10:29:42 EDT 2019 | spoiltforchoice
Well to some extent, but with QFNs, device manufacturers seem to have really gone to town with inventing new shapes and sizes. So while you could certainly generalize a bit with QFPs with common shapes like a TQPFP100 for instance; thats harder with
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Wed Jun 28 16:42:49 EDT 2000 | JAX
Paul, Most of this naming mojo happens during Gerber to Cad translation. If the Gerber software does not have a pre-defined name for a particular foot-print, The user has to supply one. Getting the supplier of the Gerber, or your CAD/CAM group to eli
Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich
I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi
