Electronics Forum | Sat Dec 12 04:21:13 EST 2009 | nkohler
Hello, We use SJ50 serie AOIs. I made a program which watches the .dat file and if an algorithm changes then my program makes a log file from the parameters of the modification. I know some numbers are which parameters, but I don't know all. I write
Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Thu Feb 27 12:27:10 EST 2003 | stevel
Hi all, We got some bare pwb in our incoming inspecion looked really wrapped. The maximum twist of the pwb we messured is 0.056inch by following the method in IPC-TM-650 2.4.22 C. (The diagonal size of our pwb is 7.5inch) According to the IPC standa
Electronics Forum | Sun May 18 19:04:54 EDT 2008 | jmelson
OK, here's a sample component file : 1 0.1uF 0.00 1 24 1.00K 0.00 1 22 10.0K 0.00 1 3 1000pF 0.00 1 3 .001uF 0.00 1 25 1.0uF 0.00 1 2 100pF 0.00 1 30 10M 0.00
Electronics Forum | Thu Jan 10 06:41:43 EST 2002 | Dreamsniper
Okay, I've read about the pros and cons about solder paste dispensing. Now, I have a Camalot 3800 and I want to experiment about dispensing solder paste. I have a needle gauge of 25GA, 23 and 22. My pcb components are; RC 0603-1812, Size B, C and D
Electronics Forum | Wed Jan 20 14:21:54 EST 1999 | Dave F
| I need some opinions (And I know everybody has one). | I am mounting a board into a case, after mounting the board | I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" dire
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