Electronics Forum | Mon Dec 22 22:05:42 EST 2014 | slouis2014
What could be the possible solution for shorted BGA but only appears on the component corners. The BGA is 18mm x 18mm in size.The component solder balls are within specs and the pad design for the BGA is with standard. How can I solve this problem
Electronics Forum | Wed Jul 26 12:22:28 EDT 2006 | cyber_wolf
The new universal guide replaces .7 - 1.8 mm tape covers. Fuji no longer makes the slitted type tape covers. How can the tape guide be mis-centered ?
Electronics Forum | Wed Feb 06 09:53:58 EST 2008 | slthomas
Something else I forgot to bring up....can we get by using our normal water soluble process or are we going to be able to clean under these things? The BGAs have .18mm and .30mm ball heights.
Electronics Forum | Tue Jan 02 02:30:18 EST 2007 | _____
Ahh yes, 254. Don't give up on the other vision types. 254 can give you skewing as well. Your width and height are awfull close. Even with the 0.5 tolerance it is using the tolerance and saying that it is OKAY. Maybe what you measure is 1.8mm for wit
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Mon Sep 14 08:10:34 EDT 2015 | iamera
Hello Our production face a problem where our board after etching become shrinkage till 0.09mm but sometime it can be till 0.18mm. this happen after etching still the beginning of process not count for silver through hole and carbon process where th
Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech
My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.
Electronics Forum | Fri Oct 14 10:55:07 EDT 2005 | Mika
We have a simular problem with Ni/Au; especially whith pcb thickness more than 1.8mm. Note: These boards have been through reflow process also. 1.)Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? 2.)Wi
Electronics Forum | Tue Jan 30 10:43:18 EST 2007 | darburch
Before you do anything to the windmills check the heights in your PD's and if you are using board supports be certain that they are set correctly. The CP 65 has approx 1.8mm of travel before the pin will get stuck, as the nozzle should only deflect .
Electronics Forum | Wed May 30 18:05:02 EDT 2007 | fredc
Chunks, Nozzle unfriendly? Maybe it should be called nozzle hostile. Depending on the machine and lighting a nozzle with a 1.8mm tube might work. In English units that would be a .072 OD with a .062 ID. The area such a nozzle would pick from is the 6
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