Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Wed Apr 26 07:49:49 EDT 2006 | jemills
No problems with ver 2.2 that I'm aware of. I'm in process eng. and part of my job is review the machine's capabilities. From what i read, Ver 2.3 & 2.4 software was designed to speed up setups and changeovers.I understand the auto teach functions is
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Tue Apr 23 15:35:45 EDT 2013 | dyoungquist
Check out IPC-A-600. Revision G (July 2004) section 3.2.3 (surface) and section 3.2.4 (internal) give min/max thicknesses for various weight copper. The min also changes depending on what class (1-3) standard you are working to.
Electronics Forum | Wed Apr 26 10:56:13 EDT 2006 | JEM
Mydata sales for TPSys 2.4 says and i quote" Reduce your setup and changeover times with new features like the ability to use auto teach for vision illumination, barcode loading of trays, factory wide sharing of vision package data.TPSys 2.4 contains
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef
Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
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