Electronics Forum: 2.change (Page 1 of 2)

Problem no out put 5v panadac 770

Electronics Forum | Tue Aug 04 23:23:01 EDT 2009 | gopang

I have problem with my Panadac 770, the problem no out Put 5v, i was check : 1). Change SMPS in panadac 2). Change terminal cad 3). Change Transistor 2SC2200 4). Change transistor 2SD867 Please conform to me if have solutions and some body have wir

Film Chip Capacitor reflow problems

Electronics Forum | Mon Sep 11 17:06:53 EDT 2006 | slthomas

1. Change the part. OR 2. Change the pads to Panasonic's recommendation. Actually both are recommended from my perspective. ECHU. Shudder.

Philips CSM

Electronics Forum | Sat May 17 13:20:46 EDT 2008 | sarason

Jon, I tried to compile your code, but had to make 2 changes for happy compilation under Borland C++ Builder. Specifically: #include void outNum(double RealNum, long SigFrac) Now the question, could you post your component_file? Or was it generat

How to do with tombstoning for component '0402'

Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech

Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch

Film Chip Capacitor reflow problems

Electronics Forum | Mon Sep 11 14:58:16 EDT 2006 | cuculi54986@yahoo.com

Steve, Let me guess, you were using this one: http://www.panasonic.com/industrial/components/pdf/abd0000ce10.pdf That part sucks. They have a newer part number that is supposedly "reflow-friendly". Unfortunately, I can't convince our quality de

RJ45 Connector short issue after wave

Electronics Forum | Sat Jun 07 04:01:56 EDT 2008 | carmanah

Hi all, Need advice how to fix RJ45 short issue after wave solder m/c .Few actions taken to resolve this issue but the outcome was inclusive which was 1. Modify wave pallet 2. Change conveyor setting from 0.8meter/minute to 0.7 meter/minute 3. Clear

25 mil QFP soldering issue

Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan

Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t

MyData placement precision / alignment

Electronics Forum | Mon Aug 17 17:01:31 EDT 2020 | rgduval

+1 to what Sr. Tech said. I'd also add that you could have some uneven deterioration of the centering jaws. Check by doing a couple of things (this will help check if the tool/tip is bent/deteriorated as well): 1. Turn off mechanical centering, and

Tombstone

Electronics Forum | Fri Jan 13 12:36:48 EST 2023 | servin6154

There are a couple of things you can try that seemed to help me with this problem. 1.Get your HMS height off of the paper tape halfway between the pocket and the edge of the tape. 2. Change your "pick stroke" for that part to "0" 3. Check you compon

Re: Micro solder balling

Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss

Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone

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