Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Thu May 23 22:17:47 EDT 2002 | davef
Not intending to undercut Mike's offer, but to compliment it. Consider asking Heraeus for guidance about cleaning the residues from reflowing your paste. Some NC flux res: * Cannot be cleaned. * Can be cleaned after a relatively short period of tim
Electronics Forum | Wed Feb 10 08:37:31 EST 2016 | davef
bga hosed by physics ... to find some older threads on the topic BGA Bowing on the corners. - SMTnet [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&Thread_ID=6405 ] www.smtnet.com › Electronics Forum • Aug 22, 2003 - 5 posts - 1 au
Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel
Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir
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