Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
Electronics Forum | Fri Apr 30 15:51:06 EDT 2010 | ldavis
We are using an Asscon VP800 with Galden LS230 fluid. This is a batch machine but is working well in our high mix-low volume environment.
Electronics Forum | Sun May 16 20:47:25 EDT 2010 | aungthura
Thanks Dave I tried various sockts but all were failed.At SnPb profile,maximum- 230'c~240'c, the solder at sockets' pins not melted.Increasing to 250'C, the sockts were deformed.
Electronics Forum | Thu Feb 18 14:34:39 EST 2010 | jlawson
I have also seen on Heller ovens (even new ones EXL series) cross profile temperature differences over their spec of +/- 3 deg C, sometimes up to 7-10 deg C, 200-230mm from fixed rail. This can cause funny issues , profiling can cover this up and not
Electronics Forum | Thu Feb 18 15:25:13 EST 2010 | spitkis2
An air temperature tolerance of +/- 3 deg C along a 200mm width would not play a significant role on the board's temperature due to its thermal mass. However if the air temperature varies by 10C along the conveyers width, I can see how a 5 degree va
Electronics Forum | Wed May 19 15:42:46 EDT 2010 | davef
Hear ya. Mostly, we production people. So, we shy away from home brew soldering techniques, unless we get ourselves in a mess. That being said, there's a fair amount of stuff on the web about home brew BGA and fine pitch QFP soldering. Here's an
Electronics Forum | Mon Jun 14 08:50:56 EDT 2010 | whitewing
Just been quoted GBP500 for 5kg (2.7L) of Galden LS-230. Don;t know if the lower temp non-leadfree stuff is cheaper If anyone in the UK has a small qty they'd sell me for experimentation, (e.g. old non-leadfree stuff they no longer use) please get in
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
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