Electronics Forum | Mon May 10 16:36:16 EDT 2004 | davef
Look here: http://www.aimsolder.com/techarticles/tech%20sheet%20BGA%20voiding-%20reducing%20through%20process%20optimization.pdf We have no relationship, nor receive benefit from the company linked above.
Electronics Forum | Mon Oct 03 14:19:47 EDT 2005 | Roland
There may be some helpful information for you in this .pdf since it includes materials and cutting tolerances: http://www.orionind.com/Catalog%20Sheets/waterjet.pdf
Electronics Forum | Tue Apr 19 09:35:16 EDT 2005 | davef
You should follow your solder paste supplier recommendations. Examples are: * http://www.aimsolder.com/techarticles/tech%20sheet%20paste%20handling.pdf * http://www.efdsolder.com/PDF/ EFD_-_Frequenty_Asked_Questions.pdf * http://www.ncsmq230.indiu
Electronics Forum | Sat Nov 08 07:05:12 EST 2008 | davef
Often, your solder paste supplier provides guideline on handling their solder paste. For instance: http://www.aimsolder.com/techarticles/tech%20sheet%20paste%20handling.pdf We have no relationship, nor receive benefit from the company referenced ab
Electronics Forum | Fri Mar 28 21:54:54 EST 2003 | MA/NY DDave
Hi Notice they do call out that you should use their thinner. In the MSDS you get a clue as to the thinner they are mostly using with some additives. http://www.kester.com/PDF%20FILES/PDF%20Data%20Sheets/E%20No-Clean%20Fluxes/951%20(30Mar98)logo.p
Electronics Forum | Wed Jul 03 20:21:26 EDT 2002 | alex_kirichenko
Thanks for responding..... The question I was trying to ask is if U appetures are mechanicaly strong, if the tab in the middle won't stik up and damage squeegee blades? I never had stencil with such appeturs. We are just about to start some trials
Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas
There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here
Electronics Forum | Tue Jul 24 07:37:35 EDT 2018 | fugtussey
PACE Worldwide has a new BGA Rework Station slated for production next month called the TF 2800. . It is based on the PACE's popular TF 1800 BGA & SMT Rework System (see TF1800 at http://www.paceworldwide.com/products/area-array-bga-rework/bga-rework
Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse
Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are
Electronics Forum | Wed Oct 13 06:20:00 EDT 2010 | costache
Dear All > > I need to check the solder paste > volume inside the PTH at our board,which size is > 440x620 mm.So, I may need 3D inspection > machine,AXI, not AOI.So, does anyone recommand me > which 3D machine is suited to my PCB? Thanks in > a
