Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas
There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here
Electronics Forum | Mon Apr 29 10:42:47 EDT 2002 | Jim M.
I had problems with white residues on both WS609 and WS 3060.The WS 3060 turned out to be a carbonized material.The composition after analysis (Energy Dispersive X-ray spectrum) turned out to be tin,tin,phosphore and cloline and tin. Alpha also have
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