Electronics Forum | Tue Sep 11 04:39:14 EDT 2018 | cannizzaro
If you need to know the exact copper thickness of the board, you can ask the Fab to offer the microscopic report, I have already made a 2oz board in ALLPCB before and asked them offeed me this report,usually normal factories can offer it but need add
Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence
Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte
Electronics Forum | Mon Nov 07 16:34:55 EST 2005 | CW
If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? If I use 2 mil copper on the outside layers of a PCB, am I limited to what pitch of parts I can use? Specifically, will using 0603
Electronics Forum | Mon Nov 14 12:10:05 EST 2005 | davef
Ceramic capacitors larger then EIA size 1812 are known to be very susceptible to thermal shock damage due to their large ceramic mass.
Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW
How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a
Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW
hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Thu Oct 02 11:04:48 EDT 2003 | russ
Out of curiousity, Isn't soldermask only used as a solder processing aid and to cover the copper? Russ
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
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