Electronics Forum: 3.4a (Page 1 of 1)

Tinned leads and where the component body is defined

Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139

Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t

Know of anyone using Screen Printer (opposed to Stencil Printer) in SMTA?

Electronics Forum | Sat Apr 15 00:10:52 EDT 2023 | sarason

Having worked in a hybrid maanufacturing operation many years ago, yes stencils are great and have the required accuracy, but on the down side there were 2 operators that were absolute wizzes at turning them out and that could mean up to 20 stencil

BGA void removal

Electronics Forum | Mon Oct 07 13:15:41 EDT 2002 | razorsek

Russ, this post doesn't specificly address your original post but I thought it is relevant to your situation and future production. I have been having problems with voids using Kester's R596L paste. I contacted them for a solution to my problem. T

MPM UP2000 6410 Driver Cards Failing

Electronics Forum | Tue Nov 25 18:39:59 EST 2014 | rhcriad

We have an MPM UP2000 stencil printer and have a lot of issues with burned out 6410 driver cards (or driver cards just failing to work). I have looked over these threads and found that this is a common issue with these cards. I understand that thes

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3.4a searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

High Precision Fluid Dispensers
Potting and Encapsulation Dispensing

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
High Throughput Reflow Oven

Smt Feeder repair service centers in Europe, North, South America
2024 Eptac IPC Certification Training Schedule

Reflow Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

Stencil Printing 101 Training Course
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