Electronics Forum | Mon Jan 22 14:22:46 EST 2007 | muse95
Actually, I've been looking into this myself, and the B version doesn't help any more than the A version. The tables still only go to 4.5mm. And Appendix B has a bunch of formulas with undefined variables that I haven't been able to figure out. An
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Thu Jan 18 21:45:34 EST 2007 | davef
Take this chance to update your documentation. See Appendix B in: http://www.jedec.org/DOWNLOAD/search/jstd033b.pdf How much fun is that going to be? As an alternative, maybe your supplier can save you the pain.
Electronics Forum | Mon Aug 19 16:42:07 EDT 2013 | thanh567
W- HTLM-5 :Hydra tool length wrong for tool tube 3. expected tool length 4.5mm, tool length found -1.358mm any one out there know what to look for this issue? sensor?
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller
We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component
Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef
Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2
Electronics Forum | Fri Jan 25 14:20:31 EST 2013 | jorge_quijano
Hi there, I have a new product today, after reflow oven I've seen a black stain coming from various holes, they can be cleaned with a tissue but some of the contaminant remains inside, we are using Sn63Pb37, the stains are far from soldering areas, t
Electronics Forum | Tue Jul 30 15:04:54 EDT 2013 | ericrr
Is it just possible that H49s crysats are hard to place, so it looks like it has been place by a perfectionistic instead of looked like it had a parachute type loading. This is the H49 short stubby type crystal about 10 mm long (width) about 4.5 mm
Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef
Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu
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