Electronics Forum | Tue May 11 08:20:52 EDT 2021 | jineshjpr
Hi Anyone having IPC 4552 A ?? Can You please provide the details of Immersion Gold Thickness Recommendations mentioned in Page 21 & Additional details required for Immersion Gold Thicker Than Specification by Design mentioned in page 23.
Electronics Forum | Wed May 05 06:19:41 EDT 2021 | jineshjpr
Hi Anyone having IPC 4552 A ?? Can You please provide the details of Immersion Gold Thickness Recommendations mentioned in Page 21 & Additional details required for Immersion Gold Thicker Than Specification by Design mentioned in page 23.
Electronics Forum | Mon Oct 01 16:55:27 EDT 2001 | davef
I agree. Poor soldering technique is the most straightward way of creating solder balls during hand soldering operations.
Electronics Forum | Tue Apr 12 19:31:39 EDT 2005 | davef
Tell your fab that you'd like your ENIG according to IPC-4552. Just so that you know, IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended spec
Electronics Forum | Thu Jul 24 22:37:06 EDT 2008 | davef
As part of the IPC-4552 specification testing, they ran ENIG at 2 uinches for 1.5 million cycles for a membrane-type keypad application [there was no testing for the wiping-type switches]. They stopped testing when the membrane began breaking down. T
Electronics Forum | Thu Jan 22 05:29:25 EST 2009 | johanhuizing
I think IPC-4552 is define the thickness of Nickel as: 3 to 6�m and Gold as: 0,05�m minimum
Electronics Forum | Sun Feb 16 20:52:34 EST 2014 | staylorebad
IPC-4552 says it does. It specifically talks about ball grid array (BGA) pads so small feature size is included as valid. Scott
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Sun Sep 30 00:54:06 EDT 2001 | chinaman
Has anybody heard about solder wires for rework with a V-notch in order to avoid solder balls which might be caused by shooting flux when getting hot. The notch is as deep to reach the core so that the flux can expand easily. I can imagine the effect
Electronics Forum | Mon Oct 01 03:46:57 EDT 2001 | wbu
Have never heard of solderballs during rework using solder wire. Noticed the tendency to have little balls of flux with too hot iron and lots of solder used for shields or massive cables to be connected. Seems to me a question of believe if it does
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