Electronics Forum | Fri Feb 24 12:34:13 EST 2006 | Ticky Ticky Tembo No Sarimbo Hari Kari Bushkie Perry Pem Do Hai
Stepped stencils are usually the result of some dumb customer's requirement. 2 examples I can give: 1.) Customer demanded 50% wick-up the termination of a MELF component. No way you can get that from reflow. Played around with a drastic "step up
Electronics Forum | Wed Oct 25 13:42:32 EDT 2000 | Chris McDonald
I was wondering IF anybody has has success wave soldering a 50 (2 rows of 25) pin 0.050" pitch thru-hole connector. I seem to be getting alot of bridging no matter what I do. Is there a design spec for the size and shape of pads? The pads on the pcb
Electronics Forum | Wed Nov 28 17:02:28 EST 2007 | joeherz
We use TraCon's TraBond 2112 for staking applications where larger gaps are involved. It is formulated for PCB staking applications. The material is very low sag and high viscosity. It's 2part and comes in handy bi-paks. Work life is 20-30min.
Electronics Forum | Mon Aug 13 14:23:54 EDT 2007 | ratsalad
Ben, I'm glad I could help. Since I've rewritten the code in Java, and I think it's much nicer now. We still don't have an AOI in place, so I don't know what is happening with that. There are Windows versions of UCT you can use for
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
| 1 |
