Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Wed Nov 20 11:54:43 EST 2019 | compit
I'm trying to make a spare disk for an SMT machine. I format the new PCMCIA card with the system (using the machine's DOS, 6.20) but when the computer starts it writes that I don't have a system. How I make a floppy disk in this way - it starts from
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
Electronics Forum | Wed Nov 16 03:41:43 EST 2016 | Haizen
I need to extract data from a log file and sort the data in an Excel file. Details are as follows: - Log File is a measurement result produced by an In-Circuit Tester (no info. about it, no name, no type, nothing). - Measurement Result is from
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