Electronics Forum: 6.4 (Page 1 of 3)

room for SMT

Electronics Forum | Sat Feb 28 08:15:50 EST 2004 | davef

J-STD-001 has what you need. 3.6 Facilities ......................... 4 3.6.1 Environmental Controls ........... 4 3.6.2 Temperature and Humidity ......... 4 3.6.3 Lighting ......................... 4 3.6.4 Field Assembly Operations ........ 4 3.6.5

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Mon Dec 09 11:34:55 EST 2002 | EW

I have seen the 6.5 ug/sqin and we have a fab house using 6.4, but I have no definitive answer for today. I see some interesting discussion here which I can also follow up on.

Image Intensifier for X-Ray

Electronics Forum | Fri Dec 19 16:51:05 EST 2003 | Todd La Marche

Hi Marco, Possibly I can help you. What is the spec for this II? Is it 6", 4", 4/2". If you can give me this data, I am sure that I can get you one. Todd

Conductor or Trace Spacing

Electronics Forum | Wed Jul 06 20:40:40 EDT 2005 | davef

Voltage does not flow. Current flows as a result of a change in voltage. Current capacity of traces * Graph is IPC-2221 paragraph 6.2, Figure 6.4 * http://www.geocities.com/CapeCanaveral/Lab/9643/TraceWidth.htm

Re: Stacking chips

Electronics Forum | Wed May 17 05:13:22 EDT 2000 | Chris May

You can refer to ANSI/J-STD-001B section 6.4.3.1 which states: "When part stacking is permitted by the assembly drawing(s)/ documentation, parts SHALL not violate minimum electrical spacing between other parts or components such as terminals or othe

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 04:38:34 EDT 2005 | Rob

Hi, We used the 1 mil for 0402's etc. Admittedly most of our experience was on 2.6 & 4 mil as we mainly used the GSM's for oddform & fine pitch, but we found that the smaller chips went down better & more accurately with the smaller camera. Oh yeah

Re: PCB Support

Electronics Forum | Wed Dec 01 10:14:41 EST 1999 | Wolfgang Busko

Hi Steve, the "framepiece" I mentioned may be misunderstanding but sometimes I don�t know the common english expression. What I meant is if the PCBs do not come in panels (now you mentioned 3-up panel)the PCB supplier could add additional material to

Re: PCB warpage

Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney

Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t

Fuji cp3 and ip2 placement speed

Electronics Forum | Mon Aug 12 18:51:42 EDT 2002 | russ

The "BEST" thsat they could do is what is in the manual. BUT we all know that no-one that I know of designs boards with only 0805 on .100" centers with one component. CP 3 should give you on average maybe 10k per hour. IP 2 I really don't know sin

Can TH component be placed on solder side of Single Side PCB?

Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc

I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts

  1 2 3 Next

6.4 searches for Companies, Equipment, Machines, Suppliers & Information