Electronics Forum | Tue Aug 14 21:51:29 EDT 2001 | mugen
true.... tata why the elongation% is there.....
Electronics Forum | Tue Jan 23 17:21:30 EST 2007 | russ
Which characteristics? Russ
Electronics Forum | Tue Aug 14 20:47:29 EDT 2001 | Pete
Hi, would like to get good info on the above solder paste metal content regarding their advantage and disadvantage against each other and their effect on fine pitch solderability. regards,
Electronics Forum | Tue Aug 14 21:48:54 EDT 2001 | davef
Say isn't creep a more key issue, rather than strength?
Electronics Forum | Tue Aug 14 22:21:55 EDT 2001 | davef
But isn't elongation more of a quantification of ductility than of creep?
Electronics Forum | Thu Aug 16 05:29:29 EDT 2001 | mugen
Say din't someone previously claim, "Dave F" stands for : Damm.Averted.Verified.Eggbrain.Freakin *smart* ?!?
Electronics Forum | Thu Aug 16 19:58:49 EDT 2001 | davef
Just feel relieved that we didn't go to the matt on the use of "leaching" rather than "dissolution". And you thought this was easy, eh?
Electronics Forum | Fri Oct 14 08:12:48 EDT 2005 | lyrtech
For LUPO: speed: 4.5 inch alloy: 63Sn/37Pb Solder pot temperature: 500 Quantity of flux: just to wet the board
Electronics Forum | Fri Jan 06 19:57:19 EST 2006 | abhinavajmera
What would be the most suitable expression for ratio of Volume of Alloy to Volume of Paste for a solder paste? For example if we use 63Sn/37Pb alloy with a 90 Wt% metal what would be an appopriate expression for the Volume Ratio?
Electronics Forum | Tue Jan 23 16:22:01 EST 2007 | asir
I'm looking for a PbF solder paste with similar characteristic as the 63/37Pb alloy. What alloy composition would you recommend?
