Electronics Forum | Mon Nov 13 12:48:14 EST 2000 | Chris McDonald
Anybody have problen soldering a IC with leads that are copper base, plated with 300 u inch min. of 80Sn/20Pb solder? We are having problems soldering a 16 mil QVSOP to a Gold Flash Board. Thanks Chris
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Tue Dec 11 16:09:02 EST 2001 | mparker
What is the composition of tin to lead in the "Liquid Tinner"? It's been my experience that the higher the tin, the duller the solder appears. I've used 63/37 and 70/30 that both look shiny, whereas 80/20 does look dull. Just another thought to cons
Electronics Forum | Sat May 28 05:18:59 EDT 2005 | finepitch
I agree with Claude's comment here. As the good old 80/20 rule suggests, 80% of your lost $$ may be coming from 20% of the parts on your list. So, I would spend 80% of my efforts to sort the list by "loss in $$" and try to reduce the loss of such.
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Thu Jun 19 05:14:18 EDT 2008 | sckee
Hi, Need help on the CCGA solderability criteria.I've actually run a NPI that using CCGA yet not sure whether the solderability is accepted or not. The alloy of the column is 80/20 and the surface of the solder joint is not smooth and shine. By chec
Electronics Forum | Sat Nov 21 12:28:00 EST 2009 | flipit
There is evidence of lead being used in soldering 5000 years ago in Mesopotamia. Not a big issue for most people doing SMT but the poster should also understand why percent metal is adjusted for different solder paste alloys. You print by volume b
Electronics Forum | Wed Jul 05 20:54:17 EDT 2000 | Dave F
Hi Patrick: Mike is correct. Taking it a little differently ... The approach you take is dependent on: 1 Type of gold finish 2 Source of the staining. Since you�re talking gold fingers, this is probably hard gold. So, � * If it�s a water or an o
Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
Electronics Forum | Fri Jun 09 12:51:52 EDT 2006 | flipit
You can not solder to 30 micro inches of gold over nickel and certainly not 80 microns. You can not with tin lead solder or SAC305 anyway. The upper limit is between 6 and 10 micro inches of gold. This is what ENIG plates to. If you solder to gre
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