Electronics Forum | Fri Aug 26 05:20:12 EDT 2016 | ariss_t
component jumping should not be the issue cause u can play with the indexing speed.. overall i give 9/10
Electronics Forum | Fri Apr 14 15:46:17 EDT 2000 | Madan Mohan
I work on CSP Rework Process Development. Can anyone suggest a way by which the component top temperature during removal / replacement can be reduced for the same solder joint temperatures (for example providing metal shields over component top in t
Electronics Forum | Thu Apr 20 12:51:52 EDT 2000 | Robert Patrick
I read your query and reccommend that you take a look at using Infra-red heating technology. I just joined PDR systems and feel that the PDR Technology is appropriate for what you are trying to accomplish. Hope this helps !!
Electronics Forum | Tue Jul 18 18:08:08 EDT 2023 | davef
Vote for: JBC DPM Paste Dispenser Manual Also consider: Metcal 910-MSG Manual Syringe Gun-Kit Spoty micro-dot solder paste syringe dispenser [ https://www.tindie.com/products/avandalen/spoty-micro-dot-solder-paste-syringe-dispenser/ ]
Electronics Forum | Fri Apr 14 20:43:12 EDT 2000 | Mario J. Gislao
Mr. Mohan, I would suggest contacting OK International's Applications Engineering department directly. They are a world-recognized leader in providing BGA/CSP rework solutions and have one of the best rework machines on the market. Try contacting
Electronics Forum | Thu Aug 12 18:43:49 EDT 1999 | Wayne S.
Hello Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening 100 durometer blade. Getting "tails" on deposits. Trie
Electronics Forum | Thu Aug 12 20:17:12 EDT 1999 | Kelly Morris
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Fri Jul 08 12:53:56 EDT 2011 | markhoch
I concur with Mr. KaHrpr and Mr. Dave. Just because your measured profile falls in the middle of a process window doesn’t mean that you won’t ever have to analyze it. You may be 9/10ths of the way there, but running 25 miles won't win you a marathon
Electronics Forum | Tue Aug 02 17:55:33 EDT 2011 | dekhead
A couple of points; DEK abandoned Phlegmington, NJ back in '09, and is now USHQ in Rolling Meadows, IL Tel: +1 847 368 1155. A newcomer to the states you might want to look at as well is: Speedprint Speedprint Technology, Americas’ 5804 Breckenrid
