Electronics Forum | Tue Oct 20 09:46:16 EDT 1998 | Tom Gervascio
I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. I am looking fo
Electronics Forum | Fri Oct 23 15:15:51 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Electronics Forum | Fri Oct 23 18:13:53 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Electronics Forum | Thu Jun 10 18:33:05 EDT 2021 | kojotssss
Hi, Maybe you mean NXT versions? (application versions for nxt modules, accessory etc..?)
Electronics Forum | Mon Oct 22 15:30:57 EDT 2001 | Basaran
Is there anybody in this forum who is using TI DSP 320C6203 modules for communication devices. I would like to know if anyone has problems with Solder bump- Ni pad interface delamination or problems with signal quality.? Cemal Basaran
Electronics Forum | Wed Sep 14 02:41:49 EDT 2016 | bukas
here is well explained SMEMA interface http://www.daghee.com/?p=326 so, disconnect printer from upline modules and check are any 2 of 4 pins shortened(should be pins No 1 & 2) while machine is ready state. when machine is in busy state the same pin
Electronics Forum | Thu Oct 25 16:48:29 EDT 2001 | Cemal Basaran
We can inspect and measure strain field in anything larger than 320nm with Laser techniques we have. We can do this measurements during fatigue testing. Of course thick intermetallic region as a solid region is a problem due to the fact that you ha
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Electronics Forum | Thu Feb 19 15:17:52 EST 1998 | Bipin Napal
Available immediately. Call Bipin at 416-385-0855 Make: Electrovert Model: 500 CLV Electrical: 440V, 3Phase, 60HZ Manufacturing Date: Dec 22, 1992, and upgraded in 1994 Physical Size: Length 205.5�, Width 55� Heating Zones : 10 Upper & 10 Lo
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
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