Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D
Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Mon Jul 17 08:01:02 EDT 2000 | lh_zeng
Hi guys, I need to purchase x-ray system & rework station & Solder Paste Inspection and Data Analyser for BGA,CSP,QFP, etc. in other word, multifunction for future requirement. But I have no ideal about how to choice a product. Maybe somebody is wil
Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi
Electronics Forum | Mon Oct 21 03:52:38 EDT 2002 | Ben
I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maxim
Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1
Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
