Electronics Forum: allowing (Page 16 of 224)

Screen printing adhesive

Electronics Forum | Fri Feb 14 09:30:00 EST 2003 | blnorman

We currently use Epibond 7275 with MPM printers. Unfortunately we've had problems with Vantico (formerly Ciba) providing a consistent product. Last summer we had extreme difficulty printing due to excessively high adhesive viscosity (20% higher tha

Component loss percentages

Electronics Forum | Thu Mar 13 09:23:26 EST 2003 | jrloudenjr

What types of systems/procedures are normally used or followed to allow for scrap percentages typically from a 43,000cph placement machine.

0402 Adhesive Screen Printing

Electronics Forum | Thu Apr 03 18:10:08 EST 2003 | Print Master

0402 Adhesive printing is possible with thicker stencils in order to allow mixed component technology. We have successfully printed 0402's with a 0.008" thick SS foil. Total material release is not achievable at this thickness, but not required u

Vacuum Sealers

Electronics Forum | Thu Apr 24 09:27:56 EDT 2003 | jgregory

What I meant is the gray rubber seals, top and bottom, that are pliable to allow the SS nozzle to slip back out and still provide sealing, deform too much and "squish" out to the sides. Jason

edge clearance for inline equipment

Electronics Forum | Wed Oct 01 23:40:38 EDT 2003 | bradlanger

I was wondering if anybody could tell me what a good clearance would be for board designs to allow for the use of inline equipment? My company currently runs a batch line but I want to make sure we are designing properly for inline if the need arises

Specific Gravity

Electronics Forum | Tue Nov 04 12:11:17 EST 2003 | babe

A Customer has asked me about a chart that allows for temperature compensation when measuring specific gravity in a wave solder machine. Anyone know of any temp. conv. chart? Thanks

BGA APATURE

Electronics Forum | Wed Nov 05 18:02:48 EST 2003 | gregcr

I also have used square apps on the BGA's, this also allows for a bit more play in alignment of the ball to pad, I am interested in the reasons why to use round apps on 0603's and 0402's ???

voids- leaded and chip components

Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris

Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks

Solvent for a stencil printer

Electronics Forum | Mon Feb 16 16:23:32 EST 2004 | blnorman

We tried Ionox BC in our MPM, but evidently a feed line came loose allowing the Ionox to spray, flood, whatever on the inside of the machine. The Ionox ate through some of the insulation on the wires. As long as it stayed in the plumbing, it worked

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 19 15:16:56 EDT 2004 | wgaffubar

Thanks, but the site will only allow you to access the information if you attended the conferance. Sound interesting. arcandspark


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