Electronics Forum | Thu Aug 27 14:32:34 EDT 2020 | dekhead
Following a pressure error, if continue is pressed, the next print with THE CORRESPONDING squeegee should attempt to compensate by increase or decrease in pressure (as appropriate)... Is it: 1)Not changing at all? 2)Over compensating? 3)Under compens
Electronics Forum | Thu Nov 07 10:07:02 EST 2019 | charliedci
Requesting help from anyone with experience in reflowing Te Connect, PN 1565917-4, 200 pin connecter. Pic attached. Cannot get all 200 pins to wet, main suspect is slight PCB warping during reflow. Have adjusted reflow profile. A 2.75 inch long SMT c
Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Thu Nov 07 14:44:52 EST 2019 | bandjwet
We have been in contact with HK Yush out of Shen Zhen that is marketing an SMT metal laser cutting machine similar to the LPKF 6060 series (IA Tech SC-6060). Apparently there are no customers in the US. Does anyone in SE Asia have experience with th
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Electronics Forum | Thu Nov 14 21:57:47 EST 2019 | sssamw
yes, first of all you need confirm if solder ball around solder pad has same location, if so then check squeege if has worn area or not at same location. If not, please check sodler paste itslf to see if dry a little, if so all paste could be a littl
Electronics Forum | Wed Nov 20 09:23:53 EST 2019 | alpha1
We had a board we fought with for a while with solder balls. Checked everything, Stencil thickness at .004, reduced apertures, changed paste 3 times, changed profile 3 times. Finally changed board vendors. Went from HASL to Emersion Gold. Problem sol
Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino
Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte
Electronics Forum | Fri Nov 29 10:26:01 EST 2019 | marwan
flux my leave a white residues even after cleaning, when we want to select a flux for our Ersa Ecoslect we tryed a varity of fluxes (including the IF2005C) and we decide to use the Cobar 390-RX-HT because he gaved us the best results in soldering and
Electronics Forum | Thu Nov 14 03:12:42 EST 2019 | jefri_simorangkir
hi Team, observed excess solder after assembly jumper with manual solder method. I already try to duplicate the phenomenon with adding more solder tin/wire,adding more time for solder but not found same condition I have attached the image for the
