Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Fri Aug 03 17:00:57 EDT 2001 | mparker
Start with a definition of what you expect the AOI to achieve at each station. Will your in-line machine be post print? Place (pre-reflow) or post reflow? Rather than buy one very expensive machine to put at the end of the line, maybe a couple of
Electronics Forum | Tue Nov 06 06:23:31 EST 2007 | clampron
Good Morning Roger, The Mirtec's can be adjusted to lower your false call rate. This can be done by reducing the matching percentage for each componnent but the result of this action is that the machine becomes less selective. If you lower them too
Electronics Forum | Fri Mar 21 21:13:03 EST 2003 | iman
Russ, u mean excess flux causes "blow hole" defect?
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Sun Aug 09 15:25:17 EDT 2015 | dev88
dear sir i am new for aoi section,my work will be teaching of aoi defect and related to programming, want to know how to make program easily in mirtec 4.1.1 and what are the different standard which we must understand.
Electronics Forum | Thu Apr 27 05:45:20 EDT 2017 | pavel_murtishev
methos1979, 1. Mirtec, Marantz 2. Koh Young, Orbotech, Mirtec 3. Koh Young Zenith 4. Definitely Programs for 3D AOI are prepared really faster. Having defined component database, programming takes no more than a couple of hours. Fine tuning takes u
Electronics Forum | Wed Oct 17 09:59:12 EDT 2018 | dnachristen
That's incorrect. 3D aoi is extremely useful for determining solder flow and slope which a 2D can't do. Yes it's also great for coplanarity, tomb stoning, head and pillow and a multitude of other defects. Most 3d AOI use cad models and height measure
Electronics Forum | Wed Mar 10 08:19:01 EST 2010 | aajmera
We have these standard pitch QFPs, for which we found some coplanarity error issues. The issues surfaced during BLT. We do not have any instrument to measure the coplanarity error before the component is loaded on the placement machines. Is there any
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
