Electronics Forum: assembling (Page 416 of 599)

Re: Mounting heights

Electronics Forum | Thu Aug 26 11:01:47 EDT 1999 | Wolfgang Busko

| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea

Re: Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F

| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that

Re: No-clean stencil apertures

Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F

| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons

Re: REFLOWING WHITE TIN PLATED PADS

Electronics Forum | Wed Aug 18 21:18:00 EDT 1999 | Dave F

| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.

Re: PCB IDENTIFICATION AND MARKING

Electronics Forum | Thu Aug 19 10:36:53 EDT 1999 | John O'Brien

| CAN ANYBODY ADVISE ME AS TO INDIVIDUAL PCB IDENTIFICATION THROUGH ASSEMBLY - THE PROS AND CONS | | THANKS | Leo: I have been doing a bit of research on this topic recently. I would be glad to discuss it with you. It seems the best technology is

Re: Pick N Place UPS

Electronics Forum | Mon Aug 09 15:51:42 EDT 1999 | John Thorup

| Greetings, | | Would like to buy a 3 phase UPS for our Mydata TP11. | Been looking and generally, sales person's point of view, 10KVA @ $10,000.00 is what they recommend. Seems a lot to me??? | Called Mydata and suggested 2.2KVA per phase. | I wo

Re: Parylene Coating of Plastic Parts

Electronics Forum | Wed Aug 04 14:34:50 EDT 1999 | Dave F

| Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental condit

Micro-BGA soldering

Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L

Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg

Re: testing after SMt assembly

Electronics Forum | Tue Jul 20 06:36:50 EDT 1999 | Peter Brant

| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | Hi, The usual method is ATE, also known as a "Bed of nails" Basicall

Re: Soldering on gold

Electronics Forum | Thu Jul 15 18:58:48 EDT 1999 | Earl Moon

| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro


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