Electronics Forum | Thu Dec 27 09:56:36 EST 2012 | swag
100 sec.). If I keep TAL closer to where I like it to be, peaks are all low; around 200C to 205C. If I can't find a happy medium between TAL and PEAK, what should I consider doing?
Electronics Forum | Thu Dec 27 13:04:58 EST 2012 | dyoungquist
From the temps you list, I'm going to assume you are using leaded solder. What type of oven profile are you using: Ramp-Spike or Ramp-Soak-Spike? I think you will have better results if you use the Ramp-Soak-Spike type of oven profile. Better chan
Electronics Forum | Wed Mar 21 11:42:54 EDT 2012 | davef
Downhole solder suggestions, in order of preference are: * Kester Sn96.3Ag3.7. Most vendors do not stock straight tin-silver alloys, whose wallet is that fat? * SAC305 can usually be used in place of one of the copper-free tin-silver alloys in downho
Electronics Forum | Tue Feb 08 22:04:34 EST 2005 | davef
Tough to say. Can you accept the loss of strength of your solder connection if upto 2% of the solder is affected? * Lead and bismuth alloys can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of the eutectic all
Electronics Forum | Tue Feb 08 15:05:22 EST 2005 | Keith Lengling
I have several memory devices that have 2% bismuth in the lead coating. Is this enough bismuth to be concerned over the formation of a low temperature SnPbBi alloy? What are the allowable limits for bismuth in an SnPb process for both SMT and through
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Wed Sep 10 17:21:08 EDT 2008 | gregoryyork
Strange we use the 179~C eutectic 62/36/2 solder paste as standard in Europe. It is indeed 2% Ag in fact we dont sell 63/37 paste or very rarely. I think if you mix a little 60/40 powder with the 2% Ag alloy this overcomes the tombstoning problem.
Electronics Forum | Sat Mar 20 15:59:13 EDT 2010 | emanuel
I have a big problem in setting an smd inductor camera recognition. None of the existing options in the software version 0.99B sems to work. The part is a 6x6mm with chamfer corners of 1mm on each side, looking more as an octagon. Not only this, the
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Mon Aug 14 00:19:29 EDT 2017 | pandamw
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