Electronics Forum | Thu Jun 08 09:26:26 EDT 2023 | frankchan
placement> (curing)> reflow soldering> cleaning> inspection> rework SMT production process Surface mount process a. Single-sided assembly: (All surface-mount components are on one side of the PCB) Incoming inspection-solder paste stirring-screen prin
Electronics Forum | Fri Jan 27 16:39:34 EST 2006 | tzawaide
Actually, although we use them for board boards, its not so much for that as it is for the the b-side handling of PCBs.
Electronics Forum | Mon Jul 01 19:43:44 EDT 2013 | kumar_antom
Hi there, Its a lead free process and the paste that we're using is with this alloy composition : Sn,Ag,Cu,Bi,In.... Pls refer to the attached temp.profile.... This is a mirror Pcb....Same components on both A and B side.... A side doesn't have t
Electronics Forum | Wed Nov 03 03:26:38 EST 1999 | Wes
We have Siemens S-20 machine whose other gantry occasionally missmounts all its components in Y-direction(approx. 1/2 mm ). Most of the missmounts happens when there is a lot of 0603 or 0805s (B-side glue boards). Gantry picks up the components OK bu
Electronics Forum | Tue May 22 09:11:35 EDT 2007 | jola
Hi. We have changed our produktion from high volume to medium/low and have to start hunting change-over time. We have a lot of products with two sides and the settings of pins in the DEK 265 and Fuji QP242 machines when running b-side takes to long t
Electronics Forum | Fri Oct 23 04:16:16 EDT 1998 | Tony B
| | My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When
Electronics Forum | Wed Oct 21 16:23:11 EDT 1998 | Jeffrey Long
My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I di
Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi
Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th
Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke
Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow
Electronics Forum | Thu Oct 22 01:43:43 EDT 1998 | Frank J. de Klein
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
