Electronics Forum: backward compatibility for bga (Page 1 of 1)

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM

So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr

Pb Free BGA Backward Compatibility

Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish

Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir

Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef

Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia

BGA Vs. QFP

Electronics Forum | Wed Jul 12 11:35:07 EDT 2006 | samir

Let's pretend there's no complication with RoHS, backward, foreward compatability - bla, bla, bla Vikings. I would pick the BGA hands-down! 1.) The BGA Ball, the component's lead, IS the solder joint! 2.) No complanarity issues, bent leads, etc

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika

Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib

Reflow Profile Design

Electronics Forum | Fri Jun 15 12:08:49 EDT 2007 | ck_the_flip

Hi Grant, 1st off solder paste data sheets are just "guidelines". You always need to set your specs. based on the needs of your own process and product. Don't ever follow your solder-paste data sheet to the tee, or you're severely limiting yoursel

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip

Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu

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