Electronics Forum | Fri Sep 21 02:26:32 EDT 2018 | sebestajaromir
Hello gentleman, I saw many topics regarding aoi verification but I didn't see how You handle with board with simulated failures during life time, because we Are facing issue with ageing of tin oxidation. Is it any idea how to solved this issue?
Electronics Forum | Tue Nov 18 07:22:56 EST 2008 | wewilldoit
Hi folks! TI told us that we are the only one with the following problem... We discovered a really bad wetting characteristic of some SMD ICs from BurrBrown. At the moment: XTR106 / INA118 / ADS7844. After the reflow process we found out that this pa
Electronics Forum | Wed Nov 26 13:31:40 EST 2008 | stepheniii
I don't know why they use it. I just know I read a TI white paper that said the problem wasn't their fault even though they knew that paladium made the parts hard to solder. And once when I started a new job one of the guys said that the owner had
Electronics Forum | Thu Apr 11 11:24:55 EDT 2013 | markhoch
Thank you for your advice Eric. Different SMT Machine Platforms have different methods for handling these PCB Panels with bad circuits. (Commonly known as "X-outs"). Some platforms allow you to identify X-Outs simply by darkening in the first fid
Electronics Forum | Thu Apr 11 10:17:17 EDT 2013 | ericrr
Some times the PCB manufacture sends PCB panels with bad circuits, there are three ways to make these PCB without placing parts on the bad circuit, Well two in fact plus my method. (1) Placing a light mark on a dark background (or reverse) then the
Electronics Forum | Thu Apr 11 15:14:38 EDT 2013 | ericrr
JUKI KE-750L, A professional service person is coming next week, to fix a small list of items.
Electronics Forum | Thu Oct 27 06:36:33 EDT 2022 | richardcargill
The PCB needs to have a flat finish to the pads too - HASL finished boards don't work well with fine pitched ICs/QFNs etc
Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto
Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.
Electronics Forum | Sat Sep 14 20:42:48 EDT 2002 | kenbliss
Hi Scott Thanks for your comments, you stated "The highest attributer was clogging apertures in fine pitch, resistor networks, and BGA, Micro BGA areas" was this do just to the size of the aperture or bad or old paste or debris from inadequate clean
Electronics Forum | Fri Oct 05 03:22:41 EDT 2012 | ekki511
HI Jeff may be there was a bad , did you mean 6500,- or 650,- USD regards Ekkehart
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