Electronics Forum | Tue Jun 24 21:01:27 EDT 2008 | fowlerchang
Qulification the baking process of 70 degree and 24 hours below 10Pa. We have the experiment data which shows the weight of baked water from package with this condition is more than 125 degree at normal condition.
Electronics Forum | Fri Jun 06 22:34:20 EDT 2008 | sleech
We have spent more than two years characterizing 70 deg C dry baking. For more information visit our website http://www.InnovativeDryingCo.com I hope you find your answers there Best Regards Stu Leech
Electronics Forum | Tue Jun 17 04:46:59 EDT 2008 | fowlerchang
Vacuum baking oven can solve it. At 70 degree and 24 hours. And the vacuum is below than 10pa
Electronics Forum | Wed Jun 25 08:06:04 EDT 2008 | davef
Questions are: * What does "weight of baked water from package with this condition [70 degree and 24 hours below 10Pa] is more than 125 degree at normal condition" mean? * What is "normal condition"?
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Thu Dec 20 22:02:47 EST 2007 | davef
We know of no such calculation. We just follow the standard.
Electronics Forum | Thu Dec 27 07:50:55 EST 2007 | davef
stacked die packaging
Electronics Forum | Thu Dec 27 16:42:29 EST 2007 | davef
Thank you Bubba
Electronics Forum | Sat Jun 28 13:53:07 EDT 2008 | sleech
Fowler: Thank you for your documentation. Your finding roughly coincide with our own. We also found that 70 degree baking removes 50%/60% of the ingested moisture from moisture conditioned MSD packages We ran an additional experiment that compared
