Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Wed Sep 15 17:53:53 EDT 2004 | aaronrobinson
My question is how does heat alone (125DegC for 48hours) diffuse the water vapour in a component, I figure the amount of water vapour in grams per cubic cm will be the same regardless of temp...yes with temp the RH changes but once the component rea
Electronics Forum | Sun Sep 19 19:51:31 EDT 2004 | aaronrobinson
thanks for your reply ....yes the air is then able to hold more water vapour.... but so is the component hence there is no water vapour pressure difference and the component and the air in the oven would still be in equilibrium???? hence no effective
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Fri Dec 03 04:11:47 EST 2010 | grahamcooper22
A baking oven over 100 C will be at zero humidity. Do you really need to store pcbs/devices at 200 C...this will surely harm some products ? IPC 33B01 allows storage of MSDs in a dry cabinet at less then 5%.....these can operate at room temp or 40 /
Electronics Forum | Fri Aug 12 03:54:03 EDT 2005 | Mika
Does the pcba:s comes directly from the assembly line, You are going to do rework on? If faulty pcba:s comes back from, let say a customer from outside or the pcba:s has been on Your shelf for some days/weeks, exposed to open environment (humidity in
