Electronics Forum | Mon Oct 15 11:27:48 EDT 2001 | rob_thomas
Hello all, Does anyone have any experience using solder quick preforms for ball attach on Flex? Thanks, Rob
Electronics Forum | Mon Sep 22 04:59:10 EDT 2008 | fadzil66
I have concern about cleaning solder ball after misprinting paste on PCB, currently use vigon 200 with ultrasonic generate but only 70% solder ball able to remove, Any other method or equipment can help to clean solder ball.
Electronics Forum | Mon Aug 16 05:42:53 EDT 1999 | Omat Marasigan
Hello reflow experts, I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. thanks in advance.... ...Omat
Electronics Forum | Fri Sep 26 07:27:29 EDT 2008 | realchunks
This sounds interesting. Could you explain?
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
Electronics Forum | Mon Sep 22 15:21:19 EDT 2008 | davef
While you're waiting for others to reply, search the fine SMTnet Archives for postings like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30878
Electronics Forum | Tue Sep 23 20:56:08 EDT 2008 | davef
For additional information, download IPC-7526 - Stencil and Misprinted Board Cleaning Handbook http://www.ipc.org/html/IPC-7526.pdf
Electronics Forum | Thu Sep 25 17:44:37 EDT 2008 | gregoryyork
strongly agree dont wipe at all, we make an air operated cleaner which blows the powder off while immersed in solvents to break up the flux. cheap and effective as long as you dont wipe first
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef
Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti
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