Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Electronics Forum | Thu Aug 09 01:05:03 EDT 2012 | sajith09
I would like to understand What will be the allowable warpage for 152mm length PCB. We are observing about 1.5mm warpage. Is that acceptable? Could you please share method to calculate the warpage
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Tue May 05 21:38:40 EDT 2015 | kahrpr
Get an accurate scale. You can rent them if you do not have one or do not want to buy one. Weigh the bare board then paste the board and re-weigh it. Subtract the 2 and you have the weight. solder paste is sold buy weight so then you can calculate th
Electronics Forum | Thu Apr 07 10:58:01 EDT 2005 | Dhanish
Need help from the experts on 1)simple way to measure the PCB warpage 2)what is the maximum warpage can the SMT machine allow the to accept and place the component without problem. 3)I have seen some people are using 7mils/inch as a Warpage spec. a
Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef
Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect
Electronics Forum | Tue Jun 16 11:04:11 EDT 2015 | cyber_wolf
Who are the experts in the U.S. regarding polyimide bare board manufacturing ? We are struggling with warpage issues....
Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B
I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Fri Jul 16 17:39:33 EDT 2010 | deanm
It is a PCB design issue where the copper patterns are not balanced among the layers. Baking the boards in order to correct the warpage will not improve it. We've had a problem with one bare board in particular warping the same way from two differen
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