Electronics Forum | Fri Sep 10 00:13:48 EDT 2004 | Darren
Joe If you are building these yourself your engineering group should be able to answer your questions, if you will be using a CM they will usually have a basic DFM report which they will gladly give to you as it will make their job much easier if yo
Electronics Forum | Tue Dec 03 10:02:30 EST 2019 | dwl
This is a perfectly appropriate question for this forum. Looking at the pics, the solder joints look fine to me. can you circle the questionable joint? Maybe I'm just not seeing it. In general its fine to reflow a questionable solder joint to troub
Electronics Forum | Wed Dec 04 07:39:11 EST 2019 | proceng1
I still don't see the defect, but in general, yes you can use an iron to reflow and cracked or suspect joint. You may want to add a little flux before you apply the iron.
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Mon Jun 14 11:39:29 EDT 1999 | Marshall
| | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from m
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis
Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
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