Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Thu Jun 17 22:10:48 EDT 1999 | Earl Moon
| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on
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