Electronics Forum | Tue Jun 25 16:27:11 EDT 2002 | dason_c
Mark, you can check one of the instruction of the BGA reball process as below. http://www.winslowautomation.com/BGA-Reball-Instruct.pdf
Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian
I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug
Electronics Forum | Thu Oct 01 03:03:29 EDT 2009 | cunningham
what we are getting is open circuits not every BGA is failing we use Humiseal 1A33 and currently there is no masking instruction for around the BGA
Electronics Forum | Fri Dec 08 17:49:24 EST 2000 | Dave f
Here ya go. Now this is what we used to write our work instruction that I referenced earlier.
Electronics Forum | Tue Apr 03 17:00:46 EDT 2007 | Ryan Lee
Hi, I am using winslow reballing kit and instruction , and I have a hard time to get reball success. any one have good information to share. Please Thanks Ryan
Electronics Forum | Fri Jul 12 12:04:51 EDT 2002 | jax
The Lizard Tongue is just a thin metal strip that, when actuated, slides over the BGA component and holds it down during transport. If you contact FUJI, they should be able to give you a part number, and install instructions..... maybe even the real
Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete
We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su
Electronics Forum | Thu Oct 05 10:25:13 EDT 2017 | davef
Consider ... * National Physical Laboratory (NPL) [http://www.npl.co.uk] did an extensive amount of research on proper frequencies and power levels for ultrasonic cleaning, maybe in late 1980s or early 1990s. That report might help you sort through
Electronics Forum | Wed Jul 22 10:26:46 EDT 1998 | Bob Yost
My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board.
Electronics Forum | Thu Jul 23 07:03:09 EDT 1998 | Wayne
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
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