Electronics Forum: bga pad to big than ball (Page 1 of 23)

uBGA 380 Solder ball to pad

Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika

Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t

BGA ball to pad ratio

Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf

I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)

BGA ball to pad ratio

Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf

I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....

BGA ball to pad ratio

Electronics Forum | Tue Feb 26 10:42:48 EST 2002 | davef

Consider the hierarchy presented in http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18112

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej

Hi, what do you mean by collapsed ? Can you describe or send a photo ?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 08:44:10 EDT 2008 | rameshr

Dear Andrezj, i had attached the photos for ur reference Kindly advice.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

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