Electronics Forum | Wed Aug 06 04:23:01 EDT 2014 | philc
For SFC.... Thanks for the link. Will check that one out some more. For Hedgemon, That is an alternative idea. We actually place the BGA over the print screen and run paste over the reverse, thus laying a film of paste over the BGA balls. This seems
Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland
I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th
Electronics Forum | Fri Dec 21 15:32:57 EST 2007 | rwyman
Hey SWAG- Not an uncommon scenario where I'm at. But the bottom line is, as others have said: Profile, profile, profile. Here, we have dedicated profile boards for each product we build and in most cases they're EXACT representations (my library i
Electronics Forum | Tue Sep 14 11:26:18 EDT 2004 | Simon UK
Hi All, Ok, now i have hit a brick wall with our design department and due to limited space on our standard sized boards we are going down the Double-Sided route. We have a 8 zone (4 Top/Bottom) Quad ZCR Convection (Ok! you can stop laughing!) and
Electronics Forum | Thu May 19 12:36:53 EDT 2005 | Brenda Robinson, SPHR
Hello. I am an HR Manager looking to benchmark pay rates for engineers in the Midwest with experience in reverse engineering and component level repair experience. The experience should be in BGA type repair with the core experience in setting the
Electronics Forum | Wed Aug 24 08:43:45 EDT 2005 | PWH
What kind of problems/defects/process indicators are you having? It is likely that you will have to bite the bullet and get a thermal profiling mole to prove that your selected profiles are subjecting parts to the correct tempertures per part specs.
Electronics Forum | Thu May 19 12:38:38 EDT 2005 | Brenda Robinson, SPHR
Hello. I am an HR Manager looking to benchmark pay rates for engineers in the Midwest with experience in reverse engineering and component level repair experience. The experience should be in BGA type repair with the core experience in setting thermo
Electronics Forum | Tue Oct 25 16:27:46 EDT 2005 | stepheniii
It is not OK to use leadfree BGA's with a lead process. Other parts "should" be reverse compatable. But I first saw problems over 5 years ago with Paladium leads and a lead process. Don't confuse saying "it's ok to use lead free parts in a leaded p
Electronics Forum | Wed Mar 20 13:54:56 EST 2002 | Aaron C
I am starting to use BGAs more and more in our process, which is using water soluble paste. Taking to the Paste Rep, he had pointed out that if you add Surfactant Packs to your inline water wash, that it would help get the water underneath the BGA pa
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
