Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Mon Feb 11 13:28:36 EST 2002 | stepheno
We have some BGA's that don't solder very well. They weren't properly stored in regards to moisture protection. The balls look dull and rough. After reflow there seemed to be a diffinate line between the balls and the solder on the PCB's. I think
Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef
LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,
Electronics Forum | Mon Feb 11 20:07:46 EST 2002 | caldon
Stephano- There is a Chemical process to revert the contamination back to its original form. The EMPF Developed it back a few years ago in conjunction with Rockwell and some others. Please contact ACI at 610-362-1200 and ask for Dr. Greg Parks. This
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Sep 08 22:13:07 EDT 2004 | Frank
Our Juki KE-2020 can place up to 74mm X 74mm ICs and BGA. I am have placed this zif socket before on the KE-2020 that you are speaking of. I don't think the KE-2020s are being made any longer. I know the new KE-2060 machines (that replaced the KE-
Electronics Forum | Wed Sep 08 15:59:25 EDT 2004 | kbayram
Hello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern. At the moment I have only found the quad ivc to be capable although I'm worried about the placement accuracy and repeatabi
winsouce.jpg)