Electronics Forum | Tue May 24 10:01:31 EDT 2005 | Rob
Hi, We're changing the way we train our staff & I was looking at getting hold of some of those sample boards you used to see around with all of the different case sizes on - 0201 up to 2512, SO8's, BGA's etc. Does anyone know if people sell these
Electronics Forum | Wed Nov 06 19:59:39 EST 2002 | davef
Consider checking with your CC materials supplier for suggestions. It's to their benefit to help you do a good job using their product. Regardless of your current requirements, consider basing your workmanship on NASA-STD-8739.1 Workmanship Standar
Electronics Forum | Tue Nov 05 17:00:40 EST 2002 | MikeF
Does anyone know of a good basic conformal coat training class for operators? Or can anyone recommend a company that offers a conformal coat training class, in the US? We want to add more capability to our operations, and have stumbled a bit in our
Electronics Forum | Wed Apr 16 15:38:46 EDT 2008 | ck_the_flip
This person needs to have the "mental faculties" and a basic understanding of science, and understand concepts like flux, solder paste, time vs. temperature curves, etc. Do they have to be a metallurgist?? Of course not, but at the minimum they hav
Electronics Forum | Tue Mar 09 17:41:24 EST 2004 | davef
Try this: * Run the board through your reflow oven set for a "normal" recipe, but with the cooling section turned off. * Pick the BGA from the board while the solder is still liquid using tweezers [or similar tool].
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
Electronics Forum | Thu Feb 19 00:31:55 EST 1998 | Larry
The type of training I am looking for is things like micro BGA, flipchip, COB, new processes and techniques, ect. I already work with things like fine pitch QFP's, high mix double reflowed boards every day. I live in Vancouver, but I can drive to Sea
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
Electronics Forum | Tue Apr 23 09:52:57 EDT 2024 | tommy_magyar
Hi there, As long as there is a standard procedure (choosing a so called bad-board-sensor [BBS], machines being taught in with this option, and operators trained) the impact should not be high. True that you have to push more panels through. The t
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