Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F
Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Thu Sep 18 12:11:45 EDT 2008 | jwentz
Does anyone have experience with using Pb-free SAC105? We are looking at the pro's/con's compared to a SAC305 process for a SMT operation. I have read it has a higher melting temperature. Specifically, we are concerned about a product we are developi
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Wed Jun 13 13:50:49 EDT 2001 | DaveG
I don't have any actual "hard" data to give on improvements but, I can share some experiences with you. What we noticed when we implemented the Rheo pump was: No more solder "skips" on our boards, Improved print quality on our BGA's & 16mil fine pitc
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny
We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som
Electronics Forum | Tue May 08 13:39:27 EDT 2001 | genny
Thank you for your response. I have been told that x-ray strength is finding solder volume and pattern root cause defects, and will catch a high % of them - opens, shorts, insufficient solder, and missing components(shape of solder on pad w/o lead i
Electronics Forum | Tue May 08 11:27:49 EDT 2001 | Eyal Duzy
I will review some of the advantages/disadvantages of AOI vs. X-Ray one by one according to the main differences that you may find between them. * AOI uses optics that can "see" only visible elements. X-Ray can "see" hidden elements. There is a ve
