Electronics Forum: board rework (Page 1 of 116)

High frequency application board V.S rework CSP

Electronics Forum | Fri May 30 13:26:13 EDT 2003 | caldon

Ben- My understanding of Tacky Flux is for Automation process where the Tacky Flux helps hold the component in place. If you are using a rework system that holds the Board firm..then typical no clean flux (Flux Pen) should work fine. I can only asum

High frequency application board V.S rework CSP

Electronics Forum | Fri May 30 04:20:59 EDT 2003 | Ben

Hi all I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is

BGA rework

Electronics Forum | Mon Mar 08 07:29:53 EST 2004 | mrmaint

Sounds like you have some delamination problems. How hot is the board getting? Try baking the board prior to rework. Is the quality of the board good? Goog Luck. MrMaint

PCBA rework

Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari

Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks

PCBA rework

Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele

I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar

BGA rework

Electronics Forum | Thu Mar 29 09:15:42 EDT 2007 | chrissieneale

Humm OK - sort of what i thought - So 90% of the time it's something else - but I assume that if you say that you are fairly confindent that you have a robus process around BGAs - where as i do not. Can we assume that it is actually the BGAs (as so

QFP rework

Electronics Forum | Thu Apr 01 11:53:33 EST 2004 | russ

You may want to tack a coup[le of leads first, making sure that the component is fully seated against the PCBA. Or what we do is apply solder to the E-Pad and the lead pads and then hit it with a "heat gun" until the solder melts on the E-Pad and th

BGA rework

Electronics Forum | Wed May 22 13:51:20 EDT 2002 | Phil

2 suggestions - Get a good scope - at least a 4X, but more like a 6X, 10X is best. You have a choice on used equipment for a substantial savings. A Leica Stereo 4 zoom is it. You can look for BGA scopes that have a 90` angle for looking at the balls

smt rework

Electronics Forum | Wed Aug 02 15:22:10 EDT 2006 | solderiron

Good luck finding used. Ersa is top quality but you pay for it. The IR from Ersa is a medium wavelength thus heating is consistent across the board despite different component densities and colors. PDR does not heat the same and thus you have to be m

BGA rework

Electronics Forum | Mon Mar 08 09:03:17 EST 2004 | russ

Is this problem really related to the size of the BGA OR the size/thickness of the PCB? Would I be correct in assuming that your pre-heater is small in size? Usually a board warps like this when the ramp is to great at the localized area. the imme

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