Electronics Forum | Tue Aug 29 20:42:09 EDT 2006 | davef
Once a rock star, always a rock star, eh bubba? Ozz don't forget stuff like that. After a half liter of golden merriment, I don't care about how odd the food tastes, I just want to remain agile enough to dodge the sinkholes on the way home.
Electronics Forum | Fri Aug 25 08:13:51 EDT 2006 | saaitk
Hi Folks, When temp profiling bga rework how important is thermocouple placement. Have read that holes should be drilled from board underside into ball to accomodate probe (isn't theory wonderful). Probably ok for high volume rework but for 1 or 2 of
Electronics Forum | Mon Aug 28 08:43:27 EDT 2006 | aj
Hi all, I have just got a second hand bare board loader ( PAF ) It seems to be in good working order . The loader is upline to a Dek 265gsx. I have tried all the FMI protocols but none seem to work. I am now thinking that I moght need a different pe
Electronics Forum | Mon Aug 28 14:18:21 EDT 2006 | russ
Sounds like your PCBs are now white tin. Change this to another roHS compliant finish and see if prob goes away. You must get control of the materials that you are being asked to build. Your Customer needs your advice on surface finishes, they sho
Electronics Forum | Wed Sep 20 15:56:44 EDT 2006 | Rapid
There is a quick change dedicated tooling solution. It involves a "h-tower" and a machined vacuum (or non-vacuum) plate. There are two 8mm threaded holes on the table that are there for support tooling interface. The tower or tooling bolts to thos
Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba
Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl
Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
Electronics Forum | Tue Sep 12 21:04:42 EDT 2006 | C Curk
You should look into the ACE Unit. Best unit on the market. Sells complete for $55,000. HAndles a 18 x 24 board, 1MM keep away area. Made in teh U.S. too. Email me at clcurk@att.net I can email you a link to the site.
Electronics Forum | Thu Sep 14 08:40:06 EDT 2006 | russ
you as a contract manufacturer are not responsible for your customers product. If you are not selling to them under false pretense of RoHS compliance you are fine, it will be your customer that is non-compliant. So if you build a board that is non
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