Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef
Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi
Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef
My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Electronics Forum | Tue Nov 07 22:44:39 EST 2017 | wrander1
Hi I'm new to the world of wire bonding. I seem to have some sort of pad contamination Preventing gold wire from bonding to aluminum pats. There appears to be a dozen microns size particles. And a slight crackling of the surface at 500 X. I am send
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
Electronics Forum | Wed Dec 14 12:34:56 EST 2016 | cy4223111
Hi all, Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Fri Jun 18 04:15:27 EDT 1999 | Frank
I would like to carry out a survey of all the available flipchip bump metallurgies available with the compatible bond pad finishes and compatible substrate attachment methods. The results will be posted on this forum. Your input will be very much app
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